Why is gallium arsenide (GaAs) useful for semiconductor devices operating at UHF and higher frequencies?

  1. Higher noise figures
  2. Higher electron mobility
  3. Lower junction voltage drop
  4. Lower transconductance


Which of the following device packages is a through-hole type?

  1. DIP
  2. PLCC
  3. Ball grid array
  4. SOT


Which of the following materials is likely to provide the highest frequency of operation when used in MMICs?

  1. Silicon
  2. Silicon nitride
  3. Silicon dioxide
  4. Gallium nitride


Which is the most common input and output impedance of circuits that use MMICs?

  1. 50 ohms
  2. 300 ohms
  3. 450 ohms
  4. 10 ohms


Which of the following noise figure values is typical of a low-noise UHF preamplifier?

  1. 2 dB
  2. -10 dB
  3. 44 dBm
  4. -20 dBm


What characteristics of the MMIC make it a popular choice for VHF through microwave circuits?

  1. The ability to retrieve information from a single signal even in the presence of other strong signals
  2. Plate current that is controlled by a control grid
  3. Nearly infinite gain, very high input impedance, and very low output impedance
  4. Controlled gain, low noise figure, and constant input and output impedance over the specified frequency range


What type of transmission line is used for connections to MMICs?

  1. Miniature coax
  2. Circular waveguide
  3. Parallel wire
  4. Microstrip


How is power supplied to the most common type of MMIC?

  1. Through a resistor and/or RF choke connected to the amplifier output lead
  2. MMICs require no operating bias
  3. Through a capacitor and RF choke connected to the amplifier input lead
  4. Directly to the bias voltage (VCC IN) lead


Which of the following component package types would be most suitable for use at frequencies above the HF range?

  1. TO-220
  2. Axial lead
  3. Radial lead
  4. Surface mount


What advantage does surface-mount technology offer at RF compared to using through-hole components?

  1. Smaller circuit area
  2. Shorter circuit-board traces
  3. Components have less parasitic inductance and capacitance
  4. All these choices are correct


What is a characteristic of DIP packaging used for integrated circuits?

  1. Package mounts in a direct inverted position
  2. Low leakage doubly insulated package
  3. Two chips in each package (Dual In Package)
  4. A total of two rows of connecting pins placed on opposite sides of the package (Dual In-line Package)


Why are DIP through-hole package ICs not typically used at UHF and higher frequencies?

  1. Too many pins
  2. Epoxy coating is conductive above 300 MHz
  3. Excessive lead length
  4. Unsuitable for combining analog and digital signals